Novel Structure for Metal Gate Electrode and Method of Fabrication

ABSTRACT

A semiconductor device includes a channel component of a transistor and a gate component disposed over the channel component. The gate component includes: a dielectric layer, a first work function metal layer disposed over the dielectric layer, a fill-metal layer disposed over the first work function metal layer, and a second work function metal layer disposed over the fill-metal layer.

PRIORITY DATA

The present application is a utility application of U.S. provisionalpatent application 62/879,235, filed on Jul. 26, 2019, and entitled“Novel Structure For Metal Gate Electrode And Method of Fabrication”,the content of which is hereby incorporated by reference in itsentirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs.

For example, as the device scaling down process continues, electricalresistance may become a greater concern. In conventional IC devices, itmay be difficult to reduce the gate contact resistance. As such, theperformance for conventional IC devices has not been optimized.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a perspective view of a FinFET device according to variousaspects of the present disclosure.

FIGS. 2-4 are diagrammatic three-dimensional perspective views of aportion of a semiconductor device at various stages of fabricationaccording to various aspects of the present disclosure.

FIGS. 5-17 are diagrammatic cross-sectional side views of a portion of asemiconductor device at various stages of fabrication according tovarious aspects of the present disclosure.

FIG. 18 is a flowchart of a method of fabricating a semiconductor deviceaccording to various aspects of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a feature on, connected to, and/or coupled toanother feature in the present disclosure that follows may includeembodiments in which the features are formed in direct contact, and mayalso include embodiments in which additional features may be formedinterposing the features, such that the features may not be in directcontact. In addition, spatially relative terms, for example, “lower,”“upper,” “horizontal,” “vertical,” “above,” “over,” “below,” “beneath,”“up,” “down,” “top,” “bottom,” etc., as well as derivatives thereof(e.g., “horizontally,” “downwardly,” “upwardly,” etc.) are used for easeof the present disclosure of one features relationship to anotherfeature. The spatially relative terms are intended to cover differentorientations of the device including the features. Still further, when anumber or a range of numbers is described with “about,” “approximate,”and the like, the term is intended to encompass numbers that are withina reasonable range including the number described, such as within +/−10%of the number described or other values as understood by person skilledin the art. For example, the term “about 5 nm” encompasses the dimensionrange from 4.5 nm to 5.5 nm.

Certain aspects of the present disclosure are generally related tosemiconductor devices, and more particularly to field-effect transistors(FETs), such as planar FETs or three-dimensional fin-line FETs(FinFETs). One embodiment of the present disclosure is illustrated belowusing a FinFET as an example, though it is understood that the presentdisclosure applies to non-FinFET planar devices too, unless specificallyclaimed otherwise.

Referring to FIG. 1, a perspective view of an example FinFET device 10is illustrated. The FinFET device structure 10 includes an N-type FinFETdevice structure (NMOS) 15 and a P-type FinFET device structure (PMOS)25. The FinFET device structure 10 includes a substrate 102. Thesubstrate 102 may be made of silicon or other semiconductor materials.Alternatively or additionally, the substrate 102 may include otherelementary semiconductor materials such as germanium. In someembodiments, the substrate 102 is made of a compound semiconductor suchas silicon carbide, gallium arsenic, indium arsenide, or indiumphosphide. In some embodiments, the substrate 102 is made of an alloysemiconductor such as silicon germanium, silicon germanium carbide,gallium arsenic phosphide, or gallium indium phosphide. In someembodiments, the substrate 102 includes an epitaxial layer. For example,the substrate 102 may include an epitaxial layer overlying a bulksemiconductor.

The FinFET device structure 10 also includes one or more fin structures104 (e.g., Si fins) that extend from the substrate 102 in theZ-direction and surrounded by spacers 105 in the Y-direction. The finstructure 104 is elongated in the X-direction and may optionally includegermanium (Ge). The fin structure 104 may be formed by using suitableprocesses such as photolithography and etching processes. In someembodiments, the fin structure 104 is etched from the substrate 102using dry etch or plasma processes. In some other embodiments, the finstructure 104 can be formed by a multiple patterning lithographyprocess, such as a double-patterning lithography (DPL) process. DPL is amethod of constructing a pattern on a substrate by dividing the patterninto two interleaved patterns. DPL allows enhanced feature (e.g., fin)density. The fin structure 104 also includes an epi-grown material 12,which may (along with portions of the fin structure 104) serve as thesource/drain of the FinFET device structure 10.

An isolation structure 108, such as a shallow trench isolation (STI)structure, is formed to surround the fin structure 104. In someembodiments, a lower portion of the fin structure 104 is surrounded bythe isolation structure 108, and an upper portion of the fin structure104 protrudes from the isolation structure 108, as shown in FIG. 1. Inother words, a portion of the fin structure 104 is embedded in theisolation structure 108. The isolation structure 108 prevents electricalinterference or crosstalk.

The FinFET device structure 10 further includes a gate stack structureincluding a gate electrode 110 and a gate dielectric layer (not shown)below the gate electrode 110. The gate electrode 110 may includepolysilicon or metal. Metal includes tantalum nitride (TaN), nickelsilicon (NiSi), cobalt silicon (CoSi), molybdenum (Mo), copper (Cu),tungsten (W), aluminum (Al), cobalt (Co), zirconium (Zr), platinum (Pt),or other applicable materials. Gate electrode 110 may be formed in agate last process (or gate replacement process). Hard mask layers 112and 114 may be used to define the gate electrode 110. One or moredielectric layers 115 may also be formed on the sidewalls of the gateelectrode 110 and over the hard mask layers 112 and 114. In at least oneembodiment, the dielectric layers 115 may be directly in contact withthe gate electrode 110. The one or more dielectric layers 115 may bepatterned to form gate spacers.

The gate dielectric layer (not shown) may include dielectric materials,such as silicon oxide, silicon nitride, silicon oxynitride, dielectricmaterial(s) with high dielectric constant (high-k), or combinationsthereof. Examples of high-k dielectric materials include hafnium oxide,zirconium oxide, aluminum oxide, hafnium dioxide-alumina alloy, hafniumsilicon oxide, hafnium silicon oxynitride, hafnium tantalum oxide,hafnium titanium oxide, hafnium zirconium oxide, the like, orcombinations thereof.

In some embodiments, the gate stack structure includes additionallayers, such as interfacial layers, capping layers, diffusion/barrierlayers, or other applicable layers. In some embodiments, the gate stackstructure is formed over a central portion of the fin structure 104. Insome other embodiments, multiple gate stack structures are formed overthe fin structure 104. In some other embodiments, the gate stackstructure includes a dummy gate stack and is replaced later by a metalgate (MG) after high thermal budget processes are performed.

The gate stack structure is formed by a deposition process, aphotolithography process and an etching process. The deposition processincludes chemical vapor deposition (CVD), physical vapor deposition(PVD), atomic layer deposition (ALD), high density plasma CVD (HDPCVD),metal organic CVD (MOCVD), remote plasma CVD (RPCVD), plasma enhancedCVD (PECVD), plating, other suitable methods, and/or combinationsthereof. The photolithography processes include photoresist coating(e.g., spin-on coating), soft baking, mask aligning, exposure,post-exposure baking, developing the photoresist, rinsing, drying (e.g.,hard baking). The etching process includes a dry etching process or awet etching process. Alternatively, the photolithography process isimplemented or replaced by other proper methods such as masklessphotolithography, electron-beam writing, and ion-beam writing.

FIGS. 2-4 are diagrammatic fragmentary three-dimensional perspectiveviews of a portion of a semiconductor device 200 at various stages offabrication. In some embodiments, the semiconductor device 200 may beimplemented as a FinFET device such as the FinFET device 10 discussedabove with reference to FIG. 1. Referring to FIG. 2, the semiconductordevice 200 may include a PMOS region 210 and an NMOS region 220 locatedaway from the PMOS region 210. Both the PMOS region 210 and the NMOSregion 220 are formed over a substrate 230, which may be an embodimentof the substrate 102 of FIG. 1. In some embodiments, the substrate 230includes a silicon substrate. Both the PMOS region 210 and the NMOSregion 220 also include an isolation structure 240 formed over thesubstrate 230. The isolation structure 240 may be an embodiment of theisolation structure 108 of FIG. 1. In some embodiments, the isolationstructure 240 may include a shallow trench isolation (STI).

Fin structures 250 may protrude vertically upward in the Z-directionfrom the substrate 230. The fin structures 250 may be an embodiment ofthe fin structures 104 of FIG. 1. In some embodiments, the finstructures 250 may include a silicon material. Epi-layers 270 are grownon the fin structures 250. The epi-layers 270 may be embodiments of theepi-layers 12 of FIG. 1. In some embodiments, the epi-layers 270 in thePMOS region 210 may include SiGe, whereas the epi-layers in the NMOSregion 220 may include Si. Layers 280 and 290 may also be formed overthe epi-layers 270. As non-limiting examples, the layers 280 and 290 mayincluder layers such as silicide layers, etching-stop layers,passivation layers, etc.

Dummy gate structures 300 are formed to wrap around the fin structures250, for example in a manner similar to how the gate electrode 110 wrapsaround the fin structures 104. The dummy gate structures 300 may includea dummy gate electrode, for example a polysilicon gate electrode. Gatespacers 310 are formed on sidewalls of each of the dummy gate structures300. In some embodiments, the gate spacers 310 may include one or moredielectric materials, for example silicon nitride, silicon carbonnitride (SiCN), silicon carbon oxynitride (SiCON), or a suitable low-kdielectric material. An interlayer dielectric (ILD) 350 is formed overthe isolation structure 240. In some embodiments, the ILD 350 contains alow-k dielectric material, for example a dielectric material having adielectric constant less than about 4. Portions of the ILD 350 aredisposed between the dummy gate structures 300 (or provide electricalisolation between them).

Referring now to FIG. 3, a dummy gate removal process 370 is performedto the semiconductor device 200 to remove the dummy gate structures 300.In some embodiments, the dummy gate removal process 370 includes one ormore etching processes that are configured to have etching selectivitybetween the dummy gate structures 300 and other components of thesemiconductor device 200. For example, the one or more etching processesmay be configured to have a substantially greater etching rate forpolysilicon than other materials, so that the polysilicon material ofthe dummy gate structures 300 may be removed without substantiallyremoving other components of the semiconductor device 200. As a resultof the performance of the dummy gate removal process 370, openings 380are formed in place of the removed dummy gate structures 300.

Referring now to FIG. 4, one or more layers 400 are formed over the ILD350 and in the openings 380. The one or more layers 400 may be formed byone or more deposition processes such as CVD, PVD, ALD, HDPCVD, MOCVD,RPCVD, PECVD, or combinations thereof. In some embodiments, the one ormore layers 400 may include an interfacial layer (IL) and a gatedielectric layer formed over the IL. In some embodiments, the IL mayinclude silicon oxide, and the gate dielectric layer may include ahigh-k dielectric material (e.g., a material with a dielectric constantgreater than about 4). In other embodiments, the IL or the gatedielectric layer may include an oxide material containing Si, Hf, Zr,Pb, Sb, or La, or a nitride material containing Si, Hf, Zr, Pb, Sb, orLa.

FIGS. 5-15 and 17 are diagrammatic fragmentary cross-sectional side viewof a portion of the semiconductor device 200 along an X-Z plane, so asto illustrate the various process steps performed to form a gateelectrode according to various aspects of the present disclosure. Insome embodiments, the cross-sectional cut is taken corresponding to thelocation of a cutline A-A′ shown in FIG. 4, which is aligned with achannel region of the transistor of the semiconductor device 200. Sincethe cutline A-A′ extends in the X-direction, FIGS. 5-15 and 17 may alsobe referred to as X-cut views. For reasons of consistency and clarity,component that are similar to those appearing in FIG. 4 are labeled thesame in FIGS. 5-15 and 17. It is also understood that, for reasons ofsimplicity FIGS. 5-15 and 17 illustrate the processing steps of forminga gate structure of a PMOS transistor. However, the processing steps forforming a gate structure of an NMOS transistor may be substantiallysimilar, except that where a p-type metal is formed in the PMOStransistor, an n-type metal is formed in the NMOS transistor, or viceversa, as discussed in more detailed below.

At the stage of fabrication shown in FIG. 5, the one or more layers 400are formed in the opening 380. The side portions of the one or morelayers 400 are formed on the sidewalls of the gate spacers 310. Thebottom portion of the one or more layers 400 is formed over theisolation structure 240 and over a channel region 250A (e.g., a portionof the fin structure 250). Since the X-cut of FIG. 5 is taken at thechannel region 250A, FIG. 5 shows the bottom portion of the one or morelayers 400 as being formed over the channel region 250A. Had the X-cutof FIG. 5 been taken at the isolation structure 240, FIG. 5 would haveshown the bottom portion of the one or more layers 400 disposed over theisolation structure 240.

Referring now to FIG. 6, a deposition process 420 is performed to form ametal layer 430 over the one or more layers 400 in the opening 380. Themetal layer 430 may be a p-type work function metal that is used to tunea threshold voltage (Vt) of a metal gate electrode. In some embodiments,the metal layer 430 includes TiN. In other embodiments, the metal layer430 may include a nitride material of Ti, Ta, Cr, Ni, Mo, Cu, Zr, Zn,Fe, or Sn, or an oxide material of Ti, Ta, Cr, Ni, Mo, Cu, Zr, Zn, Fe,and/or Sn. The process parameters of the deposition process 420 are alsoconfigured to control a thickness 440 of the deposited metal layer 430.In some embodiments, the thickness 440 is in a range between about 0angstroms and about 30 angstroms. Such a thickness range allows themetal layer 430 to sufficiently tune the threshold voltage, withoutoccupying too much room/space of the gate electrode.

Referring now to FIG. 7, a deposition process 450 is performed to form ametal layer 460 (also referred to as a fill-metal) over the metal layer430 in the opening 380. The metal layer 460 may include a metal materialand will serve as a main conductive portion of the metal gate electrode.In some embodiments, the metal layer 460 includes W. In otherembodiments, the metal layer 460 may include Cu, Co, or Al. The processparameters of the deposition process 450 are also configured to controla thickness 470 of the deposited metal layer 460. For example, since themetal layer 460 will serve as the main conductive portion of the metalgate electrode, the thickness 470 is configured to be substantiallygreater (e.g., at least multiple times greater) than the thickness 440of the metal layer 460. In some embodiments, the thickness 470 is in arange between about 50 angstroms and about 300 angstroms. Such athickness range allows the metal layer 460 to sufficiently serve as themain conductive portion of the gate electrode, and it yet still savessome space for the formation of other work function metal layers.

Note that the metal layer 460 has a concave cross-sectional profile. Insome embodiments, the concave cross-sectional profile may resemble theletter “U”. Such a “U-shaped” cross-sectional profile is achieved as aresult of the fill-metal layer 460 not being formed to completely fillthe opening 380. For example, a bottom portion of the fill-metal layer460 is formed over the upper surface of the metal layer 430, and sideportions of the fill-metal layer 460 are formed on sidewalls of themetal layer 430, and the opening 380 is located between the sideportions of the fill-metal layer 460. A concave recess is thereforedefined by the bottom portion and the side portions of the metal layer460.

This “U-shaped” cross-sectional profile of the fill-metal layer 460 isdifferent from conventional fill-metal layers of a gate electrode due tothe unique fabrication processing flow of the present disclosure. Forexample, in conventional semiconductor devices, a fill-metal layer doesnot define a concave recess, but rather may exhibit an “I”-likecross-sectional profile, and no additional work function metal layersmay be formed over the fill-metal layer in conventional devices.Compared to conventional devices, the “U”-like cross-sectional profileof the fill-metal layer 460 reduces contact resistance, because the“U-shape” effectively allows for a greater surface contact area with aconductive gate contact to be formed over the side portions of thefill-metal layer 460. In other words, whereas the “I”-shaped profile ofconventional devices allows a single protruding member of the fill-metallayer to be in contact with the gate contact, the “U-shaped” profile ofthe fill-metal layer 460 herein allows multiple (e.g., two) protrudingmembers to be in contact with the gate contact, which effectivelyincreases the surface contact area and therefore reduces gate contactresistance.

In addition, the fill-metal layer 460 herein has improved gap-fillingperformance compared to conventional devices, since the gap that it isfilling—the opening 380—is wider during this stage of fabrication shownin FIG. 7 that it would have been under conventional fabricationprocessing flow. Stated differently, the fill-metal is formed as a laststep in conventional devices, as all the work function metal layers havealready been formed prior to the deposition of the fill-metal. As such,the fill-metal would have to fill a relatively small/narrow opening,which places stringent requirements on the gap-filling performance ofthe fill-metal. In comparison, the fill-metal layer 460 herein is formedas an intermediate step and before the deposition of some of the workfunction metals. As such, the demands for gap-filling are not as stricton the fill-metal layer 460, since the opening 380 is still relativelywide at this stage of fabrication.

Referring now to FIG. 8, a deposition process 490 is performed to form ametal layer 500 over the metal layer 460 in the opening 380. The metallayer 500 may be another p-type work function metal that is used to tunea threshold voltage (Vt) of the metal gate electrode. In someembodiments, the metal layer 500 includes TiN. In other embodiments, themetal layer 500 may include a nitride material of Ti, Ta, Cr, Ni, Mo,Cu, Zr, Zn, Fe, or Sn, or an oxide material of Ti, Ta, Cr, Ni, Mo, Cu,Zr, Zn, Fe, and/or Sn. The process parameters of the deposition process490 are also configured to control a thickness 510 of the depositedmetal layer 500. In some embodiments, the thickness 510 is in a rangebetween about 0 angstroms and about 30 angstroms. In some embodiments, aratio between the thickness 440, the thickness 470, and the thickness510 is in a range between about 0:1:0 and about 1:10:1. Such a thicknessrange of the metal layer 500 and the ratio range of the thicknesses440/470/510 is configured to allow the metal layers 430 and 500 tosufficiently tune the threshold voltage, without occupying too muchroom/space of the gate electrode.

Referring now to FIG. 9, a deposition process 530 is performed to form ametal layer 540 over the metal layer 500 in the opening 380. The metallayer 540 may be an n-type work function metal that is used to tune athreshold voltage (Vt) of the metal gate electrode. In some embodiments,the metal layer 540 includes TiAl. In other embodiments, the metal layer540 may include an alloy material made of Ti, Al, Ta, Zr, and/or Zn. Theprocess parameters of the deposition process 530 are also configured tocontrol a thickness 550 of the deposited metal layer 540. In someembodiments, the thickness 550 is in a range between about 0 angstromsand about 30 angstroms. Such a thickness range allows the metal layer540 to sufficiently tune the threshold voltage, without occupying toomuch room/space of the gate electrode. It is understood that theformation of the metal layer 540 is optional in some embodiments,meaning that it may be omitted without substantially impacting theperformance of the semiconductor device 200.

Referring now to FIG. 10, a deposition process 560 is performed to forma metal layer 570 over the metal layer 540 in the opening 380. The metallayer 500 may be another p-type work function metal that is used to tunea threshold voltage (Vt) of the metal gate electrode. In someembodiments, the metal layer 570 includes TiN. In other embodiments, themetal layer 570 may include a nitride material of Ti, Ta, Cr, Ni, Mo,Cu, Zr, Zn, Fe, or Sn, or an oxide material of Ti, Ta, Cr, Ni, Mo, Cu,Zr, Zn, Fe, and/or Sn. The metal layer 570 may substantially fill theopening 380. It is understood that one or more planarization processes(e.g., chemical mechanical polishing (CMP)) processes may be formed tothe semiconductor device 200 to planarize or flatten the upper surfacesof the various layers 400, 430, 460, 500, 540, and 570.

In the embodiment discussed above, one p-type work function metal layer(e.g., the metal layer 430 is formed before the fill-metal layer 460,and two other p-type work function metal layers (e.g., the metal layers500 and 570) and an n-type work function metal layer (e.g., the metallayer 540) is formed after the fill-metal layer 460. However, this ismerely a non-limiting example. In other embodiments, otherconfigurations may be employed. For example, two p-type work functionmetal layers (instead of one) may be formed before the fill-metal layer460. As another example, the fill-metal layer 460 may be formed beforeall work function metal layers. As yet another example, multiplefill-metal layers may be formed, with one or more work function metallayers formed in between the multiple fill-metal layers. The materialcompositions of the work function metal layers (even if they are thesame type, e.g., all p-type metal layers) may also be configured to bedifferent from one another. Advantageously, these different types ofconfigurations allow the threshold voltage to be flexibly tuned, sincethe threshold voltage may vary as a function of either the materialcomposition of the work function metal layer(s) or the distance of thework function metal layer(s) from the channel.

It is also understood that although the embodiment discussed aboveillustrates the formation of a gate structure of a PMOS, similarprocessing steps may be performed to form the gate structure of an NMOS,but with the type of work function metal layers flipped. For example,whereas the work function metal layers 430, 500, and 570 are p-type workfunction metal layers for a PMOS, they may be n-type work function metallayers for an NMOS.

Referring now to FIG. 11, one or more etching processes 600 areperformed to the semiconductor device 200. The one or more etchingprocesses 600 may include etching-back processes, where etchingselectivity may exist between the gate spacer 310, the one or morelayers 400, and the metal layers 430, 460, 500, 540, and 570. Forexample, the metal layers 430, 500, and 540 may have a substantiallygreater etching rate than the one or more layers 400, the fill-metallayer 460, and the gate spacers 310. In some embodiments, the etchingrate is the slowest for the gate spacers 310, the etching rate of themetal layer 460 is greater than the etching rate of the gate spacers310, the etching rate of the one or more layers 400 is greater than theetching rate of the metal layer 460, and the etching rate of the metallayers 430, 500, 540, and 570 is greater than the etching rate of theone or more layers 400. As a result of the different etching rates, thevarious layers at this stage of fabrication have different heights, forexample the fill-metal layer 460 has substantially greater heights thanthe metal layers 430, 500, 540, and 570. This will be discussed in moredetail below with reference to FIG. 15. Also as a result of the one ormore etching processes 600, an opening 620 is formed. The one or morelayers 400 may serve as the gate dielectric (and optionally the IL) ofthe gate structure, and the metal layers 430, 460, 500, 540, and 570 maycollectively serve as the metal gate electrode of the gate structure.

Referring now to FIG. 12, a deposition process 640 is performed to thesemiconductor device 200 to fill the opening 620 with a layer 650. Thelayer 650 may also be referred to as a self-aligned contact (SAC) layer.In some embodiments, the layer 650 includes a dielectric material suchas SiN, silicon carbide (SiC), SiOCN, or a metal oxide material. Aplanarization process such as a CMP process may be performed followingthe deposition process 640 to planarize the upper surface of the layer650.

Referring now to FIG. 13, a gate contact etching process 670 isperformed to the semiconductor device 200 to partially remove the layer650, thereby forming an opening 680 in place of the removed portion ofthe layer 650. The gate contact etching process 670 may include one ormore lithography processes that form a patterned photo mask (or apatterned hard mask formed using the patterned photo mask) that definesthe location and size of the opening 680. At this stage of fabrication,the upper surfaces of the metal layers 430, 460, 500, 540, and 570 areexposed by the opening 680. The side surfaces of the metal layer 460 arealso partially exposed by the opening 680.

Referring now to FIG. 14, a gate contact deposition process 690 isperformed to the semiconductor device 200 to form a conductive gatecontact 700 in the opening 680. In some embodiments, the gate contactdeposition process 690 deposits one or more metal materials or alloysthereof as the conductive gate contact 700. The conductive gate contact700 provides electrical connectivity to the metal gate electrode (e.g.,including the metal layers 430, 460, 500, 540, and 570).

As discussed above, one of the unique physical characteristics of thepresent disclosure is the “U”-like cross-sectional profile defined bythe fill-metal layer 460. Such a profile is achieved as a result of thefill-metal layer 460 being formed earlier in the fabrication processflow of the present disclosure than in conventional devices. Forexample, whereas conventional devices may form a fill-metal layer afterall the work function metal layers have been formed, the presentdisclosure forms the fill-metal layer 460 after the formation of thework function metal layer 430, but before the formation of the workfunction metal layers 500, 540, and 570. Consequently, the work functionmetal layers 500, 540, and 570 are formed within the concave recessdefined by the fill-metal layer 460.

Also as shown in FIG. 14, side portions 460A and 460B of the fill-metallayer 460 protrude vertically above the work function metal layers 430,500, 540, and 570. In other words, the uppermost surface of thefill-metal layer 460 is located above (in the Z-direction) the uppermostsurfaces of the work function metal layers 430, 500, 540, and 570. Theconductive gate contact 700 is in physical contact with the multipleside portions 460A and 460B, rather than with just one protrudingportion of the fill-metal layer in conventional devices. As a result ofthe greater surface contact area (e.g., with both the side portions 460Aand 460B herein v.s. a single portion of the fill-metal layer inconventional devices), the gate structure of the present disclosureoffers reduced contact resistance, which helps improve deviceperformance.

FIG. 15 illustrates the dimensions of various layers of thesemiconductor device 200. For example, the conductive gate contact 700has a vertical dimension or height 810 that is measured from its topmostsurface to its bottommost surface in the Z-direction. The metal layer430 has a vertical dimension or height 820 that is measured from itstopmost surface to a bottommost surface of the one or more layers 400 inthe Z-direction. The one or more layers 400 has a vertical dimension orheight 830 that is measured from its topmost surface to its bottommostsurface in the Z-direction. The metal layer 460 has a vertical dimensionor height 840 that is measured from its topmost surface to a bottommostsurface of the one or more layers 400 in the Z-direction. The gatespacer 310 has a vertical dimension or height 850 that is measured fromits topmost surface to its bottommost surface in the Z-direction.According to embodiments of the present disclosure, the height 850>theheight 840>=the height 830>the height 820>the height 810. Alternativelystated, the gate spacers 310 and the layer 650 each have more elevatedupper surfaces (e.g., more elevated in the Z-direction) than thefill-metal layer 460, and the fill-metal layer 460 has more elevatedupper surfaces than the metal layers 430, 500, 540, and 570. Therelative heights of the various layers herein allow the fill-metal layer460 to protrude vertically into the conductive gate contact 700, whichas discussed above helps reduce gate contact resistance.

Meanwhile, the metal layer 460 has a lateral dimension or width 860 thatis measured from its “leftmost” surface to its “rightmost” surface inthe X-direction. The conductive gate contact 700 has a lateral dimensionor width 870 that is measured from its “leftmost” surface to its“rightmost” surface in the X-direction. The one or more layers 400 has alateral dimension or width 880 that is measured from its “leftmost”surface to its “rightmost” surface in the X-direction. According toembodiments of the present disclosure, the width 880>the width 870>=thewidth 860. The relative widths of the various layers herein are anatural result of the performance of fabrication processes herein.

Whereas FIG. 15 illustrates a cross-sectional view of the semiconductordevice 200 at an X-Z plane (e.g., a plane cut along A-A′ as shown inFIG. 4), FIG. 16 illustrates a cross-sectional view of the semiconductordevice 200 at a Y-Z plane (e.g., a plane cut along B-B′ as shown in FIG.4). As shown in FIG. 16, the channel region 250A of the fin structure250 protrudes vertically upward in the Z-direction, and the variouslayers 400, 430, 460, 500, 540, and 570 are formed over and wrap aroundthe fin structure 250. The conductive gate contact 700 is formed overthe metal layer 570. Again, the one or more layers 400 may serve as theIL and the gate dielectric of the gate structure, and the metal layers430, 460, 500, 540, and 570 may collectively serve as the metal gateelectrode of the gate structure.

Whereas FIGS. 14-16 illustrate “long channel” embodiments of thesemiconductor device 200, FIG. 17 illustrates a “short channel”embodiment of the semiconductor device 200. For the “short channel”embodiment, the semiconductor device 200 has a shortened channel 250B inthe X-direction compared to the “long channel” embodiment. Due to theshortened channel 250B, the gate spacers 310 are formed to have a “topwide and bottom narrow” profile, meaning that the opening it defines iswider at the top and narrower at the bottom. The one or more layer 400and the metal layer 430 are formed subsequently to partially fill suchthe opening, but the “top wide and bottom narrow” profile is mostlypreserved. When the fill-metal layer 460 is formed in the opening, thenarrow bottom portion of the opening causes the fill-metal layer 460 tosubstantially fill the bottom portion of the opening, but not the top.As a result, a bottom portion 460C of the fill-metal layer 460 has an“I”-shape. In other words, the bottom portion 460C is shaped similar toa vertically protruding bar.

Meanwhile, the top portion of the fill metal layer 460 is shaped as aletter “U”, where the vertically extending segments 460A and 460B arejoined together by a horizontally extending segment 460D. Alternativelystated, the fill metal layer 460 is shaped similar to a fork, or a goalpost in American football. The top portion of the fill-metal layer460—comprising the segments 460A, 460B, and 460D—define an opening inwhich the metal layers 500, 540, and 570 are formed. The “short channel”embodiment shown in FIG. 17 still achieves a reduced gate contactresistance, since the top portion of the fill-metal layer 460 still hasmultiple “fingers” (e.g., the segments 460A-460B) that are in physicalcontact with the conductive gate contact 700.

FIG. 18 is a flowchart illustrating a method 900 of fabricating asemiconductor device according to another embodiment of the presentdisclosure. The method 900 includes a step 910 of forming a gatedielectric layer.

The method 900 includes a step 920 of depositing a first work functionmetal layer over the gate dielectric layer.

The method 900 includes a step 930 of depositing a fill-metal layer overthe first work function metal layer. The fill-metal layer defines aconcave recess.

The method 900 includes a step 940 of depositing a second work functionmetal layer in the concave recess.

The method 900 includes a step 950 of forming a dielectric material overthe first work function metal layer, the fill-metal layer, and thesecond work function metal layer.

The method 900 includes a step 960 of etching an opening through thedielectric material. The opening exposes upper surfaces and sidesurfaces of a plurality of segments of the fill-metal layer.

The method 900 includes a step 970 of filling the opening with aconductive gate contact. The plurality of segments of the fill-metallayer protrudes vertically into the conductive gate contact.

In some embodiments, the depositing the first work function metal layerand the depositing the second work function metal layer comprise:depositing a p-type work function metal layer as the first work functionmetal layer and depositing an n-type work function metal layer as thesecond work function metal layer; or depositing an n-type work functionmetal layer as the first work function metal layer and depositing ap-type work function metal layer as the second work function metallayer.

In some embodiments, the depositing the fill-metal layer is performedsuch that at least a portion of the fill-metal layer has a U-shapedcross-sectional profile.

It is understood that additional steps may still be performed before,during, or after the steps 910-970 discussed above. For example, themethod 900 may include the following steps: after the depositing thesecond work function metal layer and before the forming the dielectricmaterial: etching the first work function metal layer, the fill-metallayer, and the second work function metal layer, wherein the fill-metallayer is etched at a slower etching rate than the first work functionmetal layer and the second work function metal layer, thereby causingthe plurality of segments of the fill-metal layer to protrude above thefirst work function metal layer and the second work function metallayer. As another example, the method 900 may include the followingsteps: depositing a third work function metal layer over the fill-metallayer, wherein the second work function metal layer is deposited overthe third work function metal layer; and depositing a fourth workfunction metal layer over the second work function metal layer; whereinthe second work function metal layer and the third work function metallayer partially fill the concave recess defined by the fill-metal layer,and wherein the fourth work function metal layer completely fills theconcave recess defined by the fill-metal layer. As yet another example,the method 900 may include the following steps: before the forming thegate dielectric layer: forming a fin structure that contains asemiconductive material; forming a dummy gate structure that wrapsaround the fin structure, wherein the dummy gate structure includes adummy gate electrode and gate spacers formed on sidewalls of the dummygate electrode; and removing the dummy gate electrode, thereby forming atrench defined at least in part by the gate spacers, wherein the gatedielectric layer is formed to partially fill the trench.

Based on the above discussions, the present disclosure introduces anovel scheme of metal gate electrode formation. Rather than forming allthe work function metal layers before the fill-metal layer, the presentdisclosure forms the work function metal layer before at least some ofthe work function metal layers. As a result of the novel fabricationscheme, the fill-metal layer of the present disclosure has a “U-shaped”cross-sectional profile. For example, the fill-metal layer may havemultiple vertically protruding “fingers” that protrude into theconductive gate contact.

The gate electrode of the present disclosure offers advantages overconventional gate electrodes. However, it is understood that not alladvantages are discussed herein, different embodiments may offerdifferent advantages, and that no particular advantage is required forany embodiment. One advantage is improved performance. For example, themultiple vertically protruding fingers of the fill-metal hereineffectively increase the surface contact area between the gate electrodeand the conductive gate contact, which in turns reduces gate contactresistance. Hence, device performance is improved due to the reducedgate contact resistance. Another advantage is the improved gap-fillingperformance of the fill-metal. For example, conventional gate electrodeformation processes typically form the fill-metal after all the workfunction metal layers have been formed. At that point, the trench to befilled by the fill-metal may be quite narrow, and therefore thefill-metal needs to have good gap-filling characteristics in order tofill the trench without creating large gaps or air bubbles therein. Incontrast, since the present disclosure forms the fill-metal before atleast some of the work function metal layers, the trench to be filled bythe fill-metal herein is substantially wider than in conventionaldevices. Hence, the fill-metal herein need not have as strict/stringentrequirements with respect to its gap-filling characteristics. Theresulting device is also less likely to have air bubbles or gaps trappedin the metal gate electrode, which improves the device yield. Inaddition, since gap-filling is no longer a strict requirement for thefill-metal layer, material other than tungsten (W) may be used toimplement the fill-metal, for example Cu, Co, or Al may all be suitablecandidates for implementing the fill-metal layer herein. Otheradvantages may include compatibility with existing fabrication processesand the ease and low cost of implementation.

The advanced lithography process, method, and materials described abovecan be used in many applications, including fin-type field effecttransistors (FinFETs). For example, the fins may be patterned to producea relatively close spacing between features, for which the abovedisclosure is well suited. In addition, spacers used in forming fins ofFinFETs, also referred to as mandrels, can be processed according to theabove disclosure.

One aspect of the present disclosure pertains to a semiconductor device.The semiconductor device includes a channel component of a transistorand a gate component disposed over the channel component. The gatecomponent includes: a dielectric layer; a first work function metallayer disposed over the dielectric layer; a fill-metal layer disposedover the first work function metal layer; and a second work functionmetal layer disposed over the fill-metal layer.

Another aspect of the present disclosure pertains to a gate structure ofa transistor. The gate structure includes: a gate dielectric layer; afirst work function metal layer located over the gate dielectric layer;a fill-metal layer located over the first work function metal layer,wherein the fill-metal layer includes a U-shaped recess; and a secondwork function metal layer in the U-shaped recess. The fill-metal layerhas more elevated upper surfaces than the first work function metallayer and the second work function metal layer.

Yet another aspect of the present disclosure pertains to a method offabricating a semiconductor device. The method includes: forming a gatedielectric layer; depositing a first work function metal layer over thegate dielectric layer; depositing a fill-metal layer over the first workfunction metal layer, wherein the fill-metal layer defines a concaverecess; depositing a second work function metal layer in the concaverecess; forming a dielectric material over the first work function metallayer, the fill-metal layer, and the second work function metal layer;etching an opening through the dielectric material, wherein the openingexposes upper surfaces and side surfaces of a plurality of segments ofthe fill-metal layer; and filling the opening with a conductive gatecontact, wherein the plurality of segments of the fill-metal layerprotrudes vertically into the conductive gate contact.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand the aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of theembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A semiconductor device, comprising: a channelcomponent of a transistor; and a gate component disposed over thechannel component, wherein the gate component includes: a dielectriclayer; a first work function metal layer disposed over the dielectriclayer; a fill-metal layer disposed over the first work function metallayer; and a second work function metal layer disposed over thefill-metal layer.
 2. The semiconductor device of claim 1, wherein atleast a portion of the fill-metal layer has a concave profile in across-sectional view.
 3. The semiconductor device of claim 2, wherein:an upper portion of the fill-metal layer has a U-shape cross-sectionalprofile; and a lower portion of the fill-metal layer has an “I”-shapecross-sectional profile.
 4. The semiconductor device of claim 2, whereinthe concave profile in the cross-sectional view is defined at least inpart by a plurality of vertically-protruding side portions of thefill-metal layer, wherein the semiconductor device further comprises agate contact that is disposed over the fill-metal layer, and wherein aportion of the gate contact is disposed between thevertically-protruding side portions of the fill-metal layer.
 5. Thesemiconductor device of claim 4, wherein the gate contact is in physicalcontact with the first work function metal layer and with the secondwork function metal layer.
 6. The semiconductor device of claim 1,wherein an uppermost surface of the fill-metal layer is disposed over anuppermost surface of the first work function metal layer and over anuppermost surface of the second work function metal layer.
 7. Thesemiconductor device of claim 1, wherein: the first work function metallayer includes a first type work function metal; the second workfunction metal layer includes a second type work function metal; and thefirst type work function metal is a p-type work function metal, and thesecond type work function metal is an n-type work function metal, orvice versa.
 8. The semiconductor device of claim 7, wherein: the gatecomponent further includes a third work function metal layer that isdisposed over the fill-metal layer but below the second work functionmetal layer; and the third work function metal layer includes the firsttype work function metal.
 9. The semiconductor device of claim 8,wherein: the gate component further includes a fourth work functionmetal layer that is disposed over the second work function metal layer;and the fourth work function metal layer includes the first type workfunction metal.
 10. The semiconductor device of claim 1, wherein thedielectric layer includes an interfacial layer and a high-k dielectriclayer disposed over the interfacial layer.
 11. A gate structure of atransistor, comprising: a gate dielectric layer; a first work functionmetal layer located over the gate dielectric layer; a fill-metal layerlocated over the first work function metal layer, wherein the fill-metallayer includes a U-shaped recess; and a second work function metal layerin the U-shaped recess; wherein the fill-metal layer has more elevatedupper surfaces than the first work function metal layer and the secondwork function metal layer.
 12. The gate structure of claim 11, wherein:an upper portion of the fill-metal layer defines the U-shaped recess;and a lower portion of the fill-metal layer is located below theU-shaped recess and has a vertical bar shape.
 13. The gate structure ofclaim 11, further comprising: a third work function metal layer that islocated over the fill-metal layer but below the second work functionmetal layer; and a fourth work function metal layer that is located overthe second work function metal layer.
 14. The gate structure of claim13, wherein: the first, third, and fourth work function metal layerseach contain a first type work function metal; and the second workfunction metal layer contains a second type work function metaldifferent from the first type work function metal.
 15. A method,comprising: forming a gate dielectric layer; depositing a first workfunction metal layer over the gate dielectric layer; depositing afill-metal layer over the first work function metal layer, wherein thefill-metal layer defines a concave recess; depositing a second workfunction metal layer in the concave recess; forming a dielectricmaterial over the first work function metal layer, the fill-metal layer,and the second work function metal layer; etching an opening through thedielectric material, wherein the opening exposes upper surfaces and sidesurfaces of a plurality of segments of the fill-metal layer; and fillingthe opening with a conductive gate contact, wherein the plurality ofsegments of the fill-metal layer protrudes vertically into theconductive gate contact.
 16. The method of claim 15, further comprising,after the depositing the second work function metal layer and before theforming the dielectric material: etching the first work function metallayer, the fill-metal layer, and the second work function metal layer,wherein the fill-metal layer is etched at a slower etching rate than thefirst work function metal layer and the second work function metallayer, thereby causing the plurality of segments of the fill-metal layerto protrude above the first work function metal layer and the secondwork function metal layer.
 17. The method of claim 15, wherein thedepositing the first work function metal layer and the depositing thesecond work function metal layer comprise: depositing a p-type workfunction metal layer as the first work function metal layer anddepositing an n-type work function metal layer as the second workfunction metal layer; or depositing an n-type work function metal layeras the first work function metal layer and depositing a p-type workfunction metal layer as the second work function metal layer.
 18. Themethod of claim 15, further comprising: depositing a third work functionmetal layer over the fill-metal layer, wherein the second work functionmetal layer is deposited over the third work function metal layer; anddepositing a fourth work function metal layer over the second workfunction metal layer; wherein the second work function metal layer andthe third work function metal layer partially fill the concave recessdefined by the fill-metal layer, and wherein the fourth work functionmetal layer completely fills the concave recess defined by thefill-metal layer.
 19. The method of claim 15, further comprising, beforethe forming the gate dielectric layer: forming a fin structure thatcontains a semiconductive material; forming a dummy gate structure thatwraps around the fin structure, wherein the dummy gate structureincludes a dummy gate electrode and gate spacers formed on sidewalls ofthe dummy gate electrode; and removing the dummy gate electrode, therebyforming a trench defined at least in part by the gate spacers, whereinthe gate dielectric layer is formed to partially fill the trench. 20.The method of claim 15, wherein the depositing the fill-metal layer isperformed such that at least a portion of the fill-metal layer has aU-shaped cross-sectional profile.